alumina substrate/for telecommunication exchange/Innovacera

1. alumina substrate:

Direct bonded copper (DBC) substrates are commonly used in power modules, because of their very good thermal conductivity. They are composed of a ceramic tile (commonly alumina) with a sheet of copper bonded to one or both sides by a high-temperature oxidation process (the copper and substrate are heated to a carefully controlled temperature in an atmosphere of nitrogen containing about 30 ppm of oxygen; under these conditions, a copper-oxygen eutectic forms which bonds successfully both to copper and the oxides used as substrates). The top copper layer can be preformed prior to firing or chemically etched using printed circuit board technology to form an electrical circuit, while the bottom copper layer is usually kept plain. The substrate is attached to a heat spreader by soldering the bottom copper layer to it.

2.Advantages of alumina substrate:

high mechanical strength

fine thermal conducticity

excellent electrical isolation

good adhesion

corrosion resistant

high reliability

environmentally clean

3.Properties of alumina substrate:

4.Applications of alumina substrate:

power semiconductor modules

semiconductor refrig-erators

power control circuits

high frequency switch mode power suppliers

solid-state relays

Solar-panel arrays

telecommunications private branch exchange and receiving system

industrial electronics

5.More about Innovacera:

If u have any questions,pls feel free to contact me by skype:innovacera05 or by email:kitty(at)innovacera.com.