Min Length: Unlimited Max Length: Unlimited

Min Width: Unlimited Max Width: 1200

Min Height: 1.0 Max Height: 35.0

Mylon Silicones is the lightest high-consistency closed cell silicone rubber sheeting material on the market. It contains truly closed cells, as determined by the stringent ASTM-D-1056 water absorption under vacuum method, eliminating wicking. The formulation and construction of these sheets allows for continuous operation of materials over a wide temperature range of -85° to +400°F, with outstanding recovery after compression. The sheets skived from buns can be supplied from 0.125” to 2.00” thickness, or buns can be skived into sheets using a customer’s own equipment. There are three available ASTM-D-1056 hardness versions of the standard sheet, including one with the necessary enhanced fire retardant additives to meet UL94 V-0 specifications, and a second version with fluorosilicone sponge properties, meeting the requirements of AMS 3323. With these and other available options, Mylon silicone foam rubber sponge sheets cover a wide range of demanding physical, temperature, and chemical environments.

Mylon Closed Cell Silicone Foam Rubber Sponge Sheets are also available for direct online order via our online shopping card. Please use the chart below to select the correct part number for your requirements. Please click on the model number below to view its specification sheet.

Performance of Mylon Silicone foam

Temperature range -40°C- +200°C,short periods up to +260°C with several hours.

Features & benefits:

1.High reliability & High conductivity

2.High compressibility, soft and flexible

3.Natural stickiness, no extra surface frontal adhesives

4.Meet with the environmental requirements of ROHS and UL

Typical applications:

Communication equipment; Mobile equipment; LED Light; Video equipment;

Switching power supply; Networking equipment; Back light model;

Household appliances; Medical equipment; PC server/workstations

Application modes:

1.The filling between PCB and heat sink

2.The filling between IC and heat sink or product outer coving

3.The filling between IC and similar heatsink cooling materials