Brand New 2012 BGA rework system LY IR9500 bga rework station updated from IR9000

Function Parameter

*. Two independent heating zones, multitude temperature zones control, lead free process.

*. Top heating zone use to infrared

*. The bottom zone applies to far infrared to pre-heating to prevent PCB curve.

*. Six-section temperature controls, simulates re-flower effect completely.

*. cools PCB after heating, to prevent PCB deflection.

*. BGA welding on completion of the demolition, a voice prompt

*. Vacuum wand sucks BGA, convenient, reliable and durable

*. Card board with a special tooling for a wide variety of notebook motherboard(option )

*. COM connection, connect with computer to achieve hi-end rework function.

Rework station Steps

1. Be all set

1) Fixed motherboard

2) Shift sensor ,sensor press close to BGA chip.

3) Adjust the height of heating head with adjustment knobPrompt BGA chip in the middle of heating head heating head away from BGA chip 2CM.

2. Start heating

Select the appropriate temperature program segment, then press the start switch. In the operation can press the Emergency stop switch, stop operating!

3. After the program runs, automatic Alarm (8 SECONDS), and automatically cut off the heating power, this time you can check the following solder ball is completely liquefied, BGA chips should be subject to settlement, floating state.

3. Heating completed

1). Moving Heating head and Sensor, open the Upper fan and Cooling Fan Switch

2). Remove motherboard Clear insulating tape! 3. BGA Rework Station Cooled ,Then close Total Power!

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