Product Description

PAKCOOL™ TC-100 series thermally conductive adhesives moisture cure type(UL certification)Excellent thermal performanceWide range of viscosities for applications from potting to gap-fillingStrong structure bond;excellent adhesion to most substratesLow volatility;reduced low-molecular siloxane contentNon-corrosive to metals; low odor cure; release alcohol vapor/acetone vapor during cureOne-component,room temperature cure; easy to useUL certification Thermally Conductive Silicone Adhesive Moisture cure type TC-107 TC-107 seriesTC-107Base MaterialColorViscosity (cps)Tack free time (min @ 23°C)Thermal conductivity (W/m⋅K)Adhesive strength MPa {kgf/cm2}Hardness (Shore A)Density (g/cm3)Dielectric constant (MHz)Volume resistivity (Ω⋅cm)Shelf LifeFlammabilityContinuous use temperature

Silicone RTV-1

White

flowable

>20

0.7

1.45

75

1.70

4.4

≥2x1014

6 months

U.L.94 V-0

-60 to +200°C

APPLICATIONSSealing and bonding for thermally conductive applicationsLEDPower conversionMotion controlTelecommunicationsComputer and peripheralsAutomotive electronicsPower semiconductorsPower suppliesBetween heat-generating semiconductors or magnetic components and a heat sinkArea where heat needs to be transferred to a frame, chassis, or other type of heat spreader

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